Advanced Thermal Solutions for High-Power GPUs and Servers
Premier Global GPU Heatsink Manufacturer
2KW
200W/c㎡
Designing responsive experiences
Thermal Engineering Excellence
From Rapid Prototyping to Mass Production
What we offer
Our solutions are designed to handle the increasing heat density of next-generation CPUs and GPUs, supporting up to 2KW heat load and 200W/cm² heat flux.
Two-phase liquid cooling plate
T-Type
About us
Suzhou Shengrongyuan Co., Ltd. develops advanced thermal solutions for high-power CPU and GPU platforms, built on aerospace-derived thermal control technology.
Our systems support up to 2KW processor heat load and 200W/cm² heat flux, delivering both air and liquid cooling architectures optimized for extreme power density.
Designed for seamless integration into existing hardware platforms, our solutions combine high thermal performance with scalable manufacturing and dependable supply.
Engineered for Extreme Thermal Performance
Our solutions are designed to handle the increasing heat density of next-generation CPUs and GPUs, supporting up to 2KW heat load and 200W/cm² heat flux.
Custom Thermal Solutions
We provide complete thermal solutions tailored to specific platform requirements, from architecture design to customized module development.
Seamless Integration
Our cooling solutions are engineered to integrate with existing system architectures, reducing redesign efforts and accelerating deployment.
Scalable Manufacturing & Reliable Delivery
As a direct manufacturer, we offer stable mass production capability, consistent quality, and dependable lead times.
Behind the Stitches
Transparency is the core of our partnership, offering a direct view into our scalable, high-precision manufacturing world. We invite you to see the advanced, and stable environment we’ve built to ensure dependable delivery for global high-power projects. Our engineering team is here to bring your most ambitious GPU designs to life
Key Benefits
MLHP Heatsinks for High Heat Flux CPU & GPU
Multi-Loop Heat Pipe (MLHP) is based on the principle of loop heat pipes（LHP）. It is a capillary-driven directional circulation system that uses light pipes for liquid return. This design avoids the need for traditional heat pipe technology to rely on the internal capillary structure for liquid return, as well as the pressure loss caused by liquid return.
- Heat dissipation: 200W -- 2000W
- Maximum heat flux: > 200W/cm²
- Size: Height 1U -- 6U, length and width can be extended
- More efficient, with lower thermal resistance
Full-Service Custom Manufacturing
Our Strategic Roadmap: 5 Critical Stages to One-stop thermal management solutions provider
How do we Accelerate your brand success?
Step1: Customer Requirement Provision
The foundation of a high-performance thermal solution begins with a precise understanding of the technical environment. To ensure the accuracy of our design, we require a comprehensive set of parameters from the client.
Step2: Scheme & Design Proposal
Once the requirements are established, our engineering team initiates the design phase using professional software.
Step3: Thermal Simulation
To bridge the gap between theory and reality, we utilize advanced thermal simulation software to perform virtual stress tests on the design.
Step4: Prototype Making
After the simulation results meet the design criteria, we move to the physical prototyping stage for real-world validation.
Step5: Mass Production & Delivery
Upon successful validation of the prototype, we scale up to full-scale manufacturing while maintaining strict quality control.
Why Our
Thermal Solutions
Expect creative solutions, clear communication, and results tailored to your vision when working with us.
Can It Handle Extreme GPU Heat Loads?
Our MLHP-based thermal architecture supports up to 2KW processor heat load and 200W/cm² heat flux, delivering stable thermal performance even under sustained high-power operation. Designed to meet the cooling demands of next-generation GPUs and high-performance processors.
Will It Support Next-Generation GPU Power Density?
Derived from aerospace thermal control technology, our MLHP solution is engineered for extreme heat flux environments and scalable power densities, making it well suited for future GPU and AI accelerator platforms.
Can It Integrate Into Existing Hardware Designs?
Our cooling solutions are designed to fit within existing mechanical architectures, allowing seamless integration into current GPU and server platforms without major structural redesign. This significantly reduces development cycles and deployment time.
Is the Technology Reliable for Long-Term Operation?
Our solutions are designed for high reliability and long-term stability, ensuring consistent performance under demanding thermal conditions.
Can the Solution Be Produced at Scale?
As a direct manufacturer, we provide stable mass production capability, ensuring consistent quality, reliable supply, and scalable deployment for large-scale hardware platforms.
Does It Deliver Performance Without Excess System Cost?
By enabling efficient heat transfer and optimized thermal performance, our solutions help improve system efficiency while maintaining practical manufacturing costs.
Blog
Hello world!
Welcome to WordPress. This is your first post. Edit or delete it, then start writing!